RESEARCH PROJECTS

Development of Fault-tolerant High-performance On-Chip Communication Network for Embedded Multicore SoCs

Future System-on-Chip (SoC) will contain hundreds of components made of processor cores, DSPs, memory, accelerators, and I/O all intergared into a single die area of just a few square millimeters. Such complex system/SoC will be interconnected via a novel on-chip interconnect closer to a sophisticated network than to current bus-based solutions.This network must provide high throughput and low latency while keeping area and power consumption low. Our research effort is about solving several design challenges to enable such new paradigm in massively parallel many-core systems. In particular, we are investigating fault-tolerance, 3D-TSV integration, photonic communication, low-power mapping techniques, low-latency adaptive routing.

Patents

  1. [特 許第6846027 号] (2021.03.03) ベンア ブダ ラ　アブデラゼク (Abderazek Ben Abdallah), ''Defect-tolerant router for network-on-chip'' [ネットワークオンチップ用の欠陥耐性ルータ], 特願 2016-100732号 (2016.05.19)

  2. [特 許第6747660号]  (登録日2020.11.08）,  ベンアブダラ　アブデラゼク (Abderazek Ben Abdallah), ''それぞれ コ ントロールユニッ トを有す る非ブロック光スイッチを用いる 光ネットワーク・オン・チップシステムのセットアップ方法], 特願2015-196698号 (2015.10.02)

  3. [特 許第6284177号]   (登録日2018.2.09）,  ベンアブダラ　アブデラゼク (Abderazek Ben Abdallah), ''誤り耐性 ルータ、これを使用 するＩＣ、及び誤り 耐性ルータの制 御方法'', 特願2013-262523号 (2013.12.19)

  4. Abderazek Ben Abdallah, Khanh N. Dang, Masayuki Hisada, ‘‘Distance-aware Extended Parity Product Coding for multiple faults detection for on-chip links [三次元ICリンクにおける多重故障検出のための距離に基づく拡張パリティ積符号], 特 願 2020-171553

  5. Abderazek Ben Abdallah, Khanh N. Dang, "A three-dimensional system on chip in which a TSV group including a plurality of TSVs provided to connect between layers'', 特願2020-094220.

  6. Abderazek Ben Abdallah, Khanh N. Dang, Masayuki Hisada, "A TSV fault-tolerant router system for 3D-Networks-on-Chip," 特願 2017-218953.

Journal papers

  1. Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran, ‘‘HotCluster: A thermal-aware defect recovery method for Through-Silicon-Vias Towards Reliable 3-D ICs systems’’, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems March 2021. DOI: 10.1109/TCAD.2021.3069370

  2. Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, X. Tran, ‘‘A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems’’, IEEE Access, Volume 8, pp 166642-166657, 2020.

  3. Khanh N. Dang, Akram Ben Ahmed, Michael Meyer, Abderazek Ben Abdallah, and Xuan-Tu Tran, ‘’A non-blocking non-degrading multiple defect link test method for 3D-Networks-on-Chip,’’ IEEE Access, Vol8, pp. 59571 – 59589,  2020. DOI: 10.1109/ACCESS.2020.2982836

  4. K. N. Dang, A. B. Ahmed, A. Ben Abdallah and X. Tran, "TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems," IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 28, no. 3, pp. 672-685, 3/2020. doi: 10.1109/TVLSI.2019.2948878.

  5. The H. Vu,Yuichi Okuyama, Abderazek Ben Abdallah, “Comprehensive Analytic Performance Assessment and K-means based Multicast Routing Algorithms and Architecture for 3D-NoC of Spiking Neurons,” ACM Journal on Emerging Technologies in Computing Systems (JETC), Vol. 15, No. 4, Article 34, October 2019. DOI: 10.1145/3340963

  6. K. N. Dang, A. B. Ahmed, Y. Okuyama and A. Ben Abdallah, "Scalable Design Methodology and Online Algorithm for TSV-Cluster Defects Recovery in Highly Reliable 3D-NoC Systems," in IEEE Transactions on Emerging Topics in Computing, vol. 8, no. 3, pp. 577-590, 1 July-Sept. 2020, doi: 10.1109/TETC.2017.2762407.

  7. Khanh N. Dang, Akram Ben Ahmed, Xuan-Tu Tran, Yuichi Okuyama, Abderazek Ben Abdallah, ”A Comprehensive Reliability Assessment of Fault-Resilient Network-on-Chip Using Analytical Model”, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Vol. 25, Issue: 11, pp. 3099 – 3112, vol. 2017.  DOI: 10.1109/TVLSI.2017.2736004

  8.  Achraf  Ben Ahmed, Tsutomu Yoshinaga, Abderazek Ben Abdallah, “Scalable Photonic Networks-on-Chip Architecture Based on a Novel Wavelength-Shifting Mechanism”, IEEE Transactions on Emerging Topics in Computing, 2017. DOI: 10.1109/TETC.2017.2737016

  9. Michael Meyer, Yuichi Okuyama, Abderazek Ben Abdallah, ”SAFT-PHENIC: a thermal-aware microring fault-resilient photonic NoC”, The Journal of Supercomputing,'' Volume 74, Issue 9, pp 4672–4695, 2018. DOI: 10.1007/s11227-018-2463-x

  10. Khanh N. Dang, Michael Meyer, Yuichi Okuyama, Abderazek Ben Abdallah, ”A low-overhead Soft-Hard Fault-Tolerant Architecture, Design, and Management Scheme for Reliable High-performance Many-core 3D-NoC Systems”, Journal of Supercomputing (2017) 73:2705–2729

  11. Achraf Ben Ahmed, Abderazek Ben Abdallah,''An Energy-Efficient High-Throughput Mesh-Based Photonic On-Chip Interconnect for Many-Core Systems,'' Photonics 2016, 3(2), 15; https://doi.org/10.3390/photonics3020015

  12. Akram Ben Ahmed, Abderazek Ben Abdallah, ”Adaptive Fault-Tolerant Architecture and Routing Algorithm for Reliable Many-Core 3D-NoC Systems”, Journal of Parallel and Distributed Computing, Volumes 93–94, July 2016, Pages 30-43, ISSN 0743-7315, DOI:10.1016/j.jpdc.2016.03.014

  13. Achraf Ben Ahmed, Abderazek Ben Abdallah, “Hybrid Silicon-Photonic Network-on-Chip for Future Generations of High-performance Many-core Systems,” The Journal of Supercomputing, Dec. 2015, Vol. 71, Issue 12, pp 4446-4475. DOI: 10.1007/s11227-015-1539-0

  14. Akram Ben Ahmed, A. Ben Abdallah,”Graceful Deadlock-Free Fault-Tolerant Routing Algorithm for 3D Network-on-Chip Architectures”, Journal of Parallel and Distributed Computing, 74/4 (2014), pp. 2229-2240.

  15. Akram Ben Ahmed, A. Ben Abdallah, ”Architecture and Design of High-throughput, Low-latency and Fault-Tolerant Routing Algorithm for 3D-Network-on-Chip”, The Journal  of Supercomputing, December 2013, Volume 66, Issue 3, pp 1507-1532
Computer Engineering Division
The University of Aizu
〒965-8580 Aizu-Wakamatsu 965-8580, Japan
Contact
Ben Abdallah Abderazek
Office phone: 0242-37-2574 (3224)
Email: benab@u-aizu.ac.jp
Contents ©2020 BEN ABDALLAH LAB